Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics

Adaptive Cooling of Integrated Circuits Using Digital Microfluidics

Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.

Highly Integrated Microfluidics Design

The recent development of microfluidics has lead to the concept of lab-on-a-chip, where several functional blocks are combined into a single device that can perform complex manipulations and characterizations on the microscopic fluid sample. However, integration of multiple functionalities on a single device can be complicated. This a cutting-edge resource focuses on the crucial aspects of integration in microfluidic systems. It serves as a one-stop guide to designing microfluidic systems that are highly integrated and scalable. This practical book covers a wide range of critical topics, from fabrication techniques and simulation tools, to actuation and sensing functional blocks and their inter-compatibility. This unique reference outlines the benefits and drawbacks of different approaches to microfluidic integration and provides a number of clear examples of highly integrated microfluidic systems.

Adaptive Hot-spot Cooling of Integrated Circuits Using Digital Microfluidics