A First Course In Finite Elements By Jacob Fish And Ted Belytschko 2007 Wiley
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Introduction to Integrative Engineering
This textbook is designed for an introductory course at undergraduate and graduate levels for bioengineering students. It provides a systematic way of examining bioengineering problems in a multidisciplinary computational approach. The book introduces basic concepts of multidiscipline-based computational modeling methods, provides detailed step-by-step techniques to build a model with consideration of underlying multiphysics, and discusses many important aspects of a modeling approach including results interpretation, validation, and assessment.
A First Course in Finite Elements
Developed from the authors, combined total of 50 years undergraduate and graduate teaching experience, this book presents the finite element method formulated as a general-purpose numerical procedure for solving engineering problems governed by partial differential equations. Focusing on the formulation and application of the finite element method through the integration of finite element theory, code development, and software application, the book is both introductory and self-contained, as well as being a hands-on experience for any student. This authoritative text on Finite Elements: Adopts a generic approach to the subject, and is not application specific In conjunction with a web-based chapter, it integrates code development, theory, and application in one book Provides an accompanying Web site that includes ABAQUS Student Edition, Matlab data and programs, and instructor resources Contains a comprehensive set of homework problems at the end of each chapter Produces a practical, meaningful course for both lecturers, planning a finite element module, and for students using the text in private study. Accompanied by a book companion website housing supplementary material that can be found at http://www.wileyeurope.com/college/Fish A First Course in Finite Elements is the ideal practical introductory course for junior and senior undergraduate students from a variety of science and engineering disciplines. The accompanying advanced topics at the end of each chapter also make it suitable for courses at graduate level, as well as for practitioners who need to attain or refresh their knowledge of finite elements through private study.
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
Author: Mohd Arif Anuar Mohd Salleh
language: en
Publisher: Springer Nature
Release Date: 2023-07-02
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.