A Clustering Analysis Model For Golden Die Extractions Based On Wafer Acceptance Test At Semiconductor Rd Stage
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A Clustering Analysis Model for Golden Die Extractions Based on Wafer Acceptance Test at Semiconductor R&D Stage
During the research and development (R&D) stage of semiconductor fabrication, the R&D engineers make a lot of effort to identify golden dice that meet simulated performance of circuit design. With feedback from wafer acceptance test (WAT) data of the golden dice, the efficiency of process window analysis can be further improved. However, it is difficult for current practices to select golden dice due to limited time and cost concerns. In this research, an analytical model is proposed to analyze WAT data during the R&D stage of semiconductor fabrication to assist R&D engineers in resolving these critical issues. WAT data are collected and utilized to classify dice on a wafer and similar golden dice are then identified based on pre-defined golden dice. Similar golden dice can provide much more important feedback from WAT data, and the efficiency of process window analysis can then be improved. Real WAT data at the R&D stage during semiconductor fabrication were collected from a famous semiconductor manufacturing company and were experimented through the presented methodology. Experimental results show that the presented model can successfully extract representative similar golden dice within clusters. With advice from R&D engineers, the representative similar golden dice extracted from this work are sufficient for subsequent process window analysis.
The Greenhouse Gas Protocol
The GHG Protocol Corporate Accounting and Reporting Standard helps companies and other organizations to identify, calculate, and report GHG emissions. It is designed to set the standard for accurate, complete, consistent, relevant and transparent accounting and reporting of GHG emissions.
Reflow Soldering Processes
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process