2010 17th Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits
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ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author: ASM International
language: en
Publisher: ASM International
Release Date: 2018-12-01
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.