Semiconductor Packaging Materials Interaction And Reliability Pdf
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Semiconductor Packaging
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Hardware Security
This book provides a look into the future of hardware and microelectronics security, with an emphasis on potential directions in security-aware design, security verification and validation, building trusted execution environments, and physical assurance. The book emphasizes some critical questions that must be answered in the domain of hardware and microelectronics security in the next 5-10 years: (i) The notion of security must be migrated from IP-level to system-level; (ii) What would be the future of IP and IC protection against emerging threats; (iii) How security solutions could be migrated/expanded from SoC-level to SiP-level; (iv) the advances in power side-channel analysis with emphasis on post-quantum cryptography algorithms; (v) how to enable digital twin for secure semiconductor lifecycle management; and (vi) how physical assurance will look like with considerations of emerging technologies. The main aim of this book is to serve as a comprehensive and concise roadmap for new learners and educators navigating the evolving research directions in the domain of hardware and microelectronic securities. Overall, throughout 11 chapters, the book provides numerous frameworks, countermeasures, security evaluations, and roadmaps for the future of hardware security.
Semiconductor Advanced Packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.