Pcb Trace And Via Currents And Temperatures
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PCB Design Guide to Via and Trace Currents and Temperatures
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
Pcb Trace and Via Currents and Temperatures
Author: Douglas Brooks
language: en
Publisher: Createspace Independent Publishing Platform
Release Date: 2016-03-04
Finally! For the first time, here is a complete, thorough analysis of the relationships between PCB trace (and via) currents and trace temperatures. All in one place! Brooks has been looking at these relationships since the mid '90s. And he has assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal gradients, etc.); (f) Via temperatures and what determines them; (g) Via current densities; (h) Fusing issues, what happens when traces are overloaded, and (g) a chapter showing how unevenly traces heat, even at low temperatures. There are supplemental chapters or appendices on measuring the thermal conductivity of dielectrics and measuring the resistivity of copper traces (and why many prior attempts have been doomed to failure.) And there is even a chapter on whether Industrial CT Scanning might replace microsections for measuring trace parameters. Never before has such a thorough compendium been available, especially so conveniently.
Pcb Trace and Via Currents and Temperatures
Brooks has been looking at these relationships since the mid '90s. And he has assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal gradients, etc.); (f) Via temperatures and what determines them; (g) Via current densities; and (h) Fusing issues, what happens when traces are overloaded. There are supplemental chapters or appendices on measuring the thermal conductivity of dielectrics and measuring the resistivity of copper traces (and why many prior attempts to do so have been doomed to failure.) And there is even a chapter on whether Industrial CT Scanning might replace microsections for measuring trace parameters. This Second Edition adds two new chapters (on AC currents and on thermal gradients around right-angle corners), a greatly expanded Chapter 6 (Thermal Simulations), and other additional information throughout the text.