Metre Laser
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Laser Processing in Manufacturing
Author: R. Crafer
language: en
Publisher: Springer Science & Business Media
Release Date: 1992-12-31
Lasers are now recognized as practical alternatives to conventional techniques for many industrial applications. After reviewing the basic theory the book provides an insight into equipment technology and applications.
Engineering Surveying Technology
This book examines the major changes in the technology now used for the measurement and processing of topographic and non-topographic spatial data, with emphasis on the new and emerging technology and its applications. Fundamental principles are introduced to explain the basic operation of different types of equipment.
Wafer Bonding
Author: Marin Alexe
language: en
Publisher: Springer Science & Business Media
Release Date: 2013-03-09
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.