Advanced Pack
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Materials for Advanced Packaging
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Advanced Packaging Technologies For Fruits and Vegetables
The book begins with a short narration of current packaging practices followed by present day horticulture industry. After pointing out the disadvantages of some of the current practices, the author categorically states that we do not need to religiously follow traditional packaging practices if we are serious about curtailing the supply chain loss of fruits and vegetables. The author goes on listing out various types of packaging materials that are available today before addressing the major theme of the book, i.e. ‘Modern Innovations in Packaging Materials and Packaging Technologies’. MAP films, MIP films and active and intelligent packing materials are described in detail under this topic. Manufacturing process of polymer-based packing materials is also described for the better understanding of the reader. The author then elaborates on how to select a suitable packing material for your horticultural produce. Major two parameters that are to be considered are packing material properties and product-specific properties. The author makes a reference of various packaging designs and packaging standards also for those who are interested in these topics. According to the author advanced packaging technologies such as modified atmosphere packaging, modified interactive packaging, active and intelligent packaging, TBG technology and packaging technology for microwaveable containers are going to make a big difference in the way how highly perishable fruits and vegetables are packed and consumed. Finally, the author gives a short narration of various types of packaging machines that are available today and also lists out major global suppliers of packaging solutions for horticulture industry.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.